X-FAB
As the world's leading foundry group for analog/mixed-signal semiconductor
applications, X-FAB creates a clear alternative to typical foundry services by
combining solid, specialized expertise in advanced analog and mixed-signal
process technologies with excellent service, a high level of responsiveness and
first-class technical support.
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Beyond Semiconductor
Beyond Semiconductor is a privately held fabless semiconductor IP company
supplying embedded processor IP technology for digital consumer, networking,
personal entertainment, communications and industrial applications.
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i2a Technologies
Silicon Valley's resource for manufacturing.
i2a Technologies provides IC packaging, system and module
assembly, wafer bumping and related services.
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TSMC
Established in 1987, TSMC is the world's first dedicated semiconductor
foundry. As the founder and a leader of the Dedicated IC Foundry segment,
TSMC has built its reputation by offering advanced and "More-than-Moore"
wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry segment's
leading technologies and TSMC COMPATIBLE® design services.
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Global Unichip
GUC provides total solutions from silicon-proven IPs to complex
time-to-market SoC turnkey services. GUC is committed to providing
the most advanced and the best price-performance silicon solutions
through close partnership with TSMC, GUC’s major shareholder,
and other key packaging and testing power houses.
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TOWERjazz
TowerJazz provides customized and modular process
technologies, specialized applications knowledge, custom design tools and
models, and IP and design services that are coupled with high value, multiple
fab site flexibility only a pure-play Specialty Foundry can provide.
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Aspen Technologies
Aspen Technologies’ Mission is to enable its customers to rapidly bring new
products to market through the creative application of advanced microelectronic
package and assembly technologies, innovative engineering, and scalable
manufacturing solutions.
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Spectrum Semiconductor
Spectrum Semiconductor Materials, Inc. is the industry leader in providing
ceramic packages for IC assembly. Spectrum has the largest in-stock inventory of
ceramic and plastic packages.
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EAG
Evans Analytical Group® (EAG) is the world's leading, fully integrated,
independent laboratory network. We provide global analytical services focused on
surface analysis and materials characterization.
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TriQuint Semiconductor
TriQuint Semiconductor is the leader in
high-performance RF components for wireless communication. TriQuint’s components
enable quicker design turns, higher performance, lower part count and lower
overall solution cost.
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CORWIL
CORWIL was founded in 1990 to provide high quality and responsive IC assembly
and test services to the semiconductor, OEM electronics, military and aerospace,
and medical industries. Excellent quality and superior service have been the
hallmarks of CORWIL's success.
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Unisem
Unisem Group is a global provider of semiconductor assembly and test services
for many of the world's most successful electronics companies. Unisem offers an
integrated suite of packaging and test services such as wafer bumping, wafer
probing, wafer grinding, a wide range of of leadframe and substrate IC packaging
including leaded, QFN, BGA and FlipChip packages, and high-end RF and mix-signal
test services.
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FAST Semi
FAST Semi was founded in 2003
to service the ever growing device level packaging and failure analysis need.
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